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Die Bonder Product List and Ranking from 11 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.

Die Bonder Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.

  1. 兼松ＰＷＳ Kanagawa//Industrial Machinery
  2. Woyton Technologies Kanagawa//Trading company/Wholesale
  3. ファスフォードテクノロジ Yamanashi//Industrial Machinery
  4. 4 キヤノンマシナリー Shiga//Industrial Machinery
  5. 5 null/null
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Die Bonder Product ranking

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.

  1. ASMPT manufactured AD838L-G2 epoxy die bonder 兼松ＰＷＳ
  2. ASMPT AD830Plus Epoxy Die Bonder 兼松ＰＷＳ
  3. Dia Attach System Woyton Technologies
  4. 4 Fasford Technology "SiP Bonder (DB830plus+)" ファスフォードテクノロジ
  5. 5 ASMPT manufactured flip chip bonder/die bonder CoS 兼松ＰＷＳ

Die Bonder Product List

1～30 item / All 35 items

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Epoxy die bonder

Epoxy die bonder

Easy epoxy bonding is possible.

A machine that easily performs epoxy and silver paste die bonding. The model 7200CR epoxy die bonder features a dispensing tube for applying epoxy materials (adhesives) and silver paste, along with a pickup tool for attracting chips, all integrated into a single bond head. With the operation of the new X-Y-Z three-axis manipulator (patented), it is possible to switch between dispensing mode and pickup mode, as well as perform die bonding. Additionally, since the bond head is equipped with a motor and timing belt, the chips attracted by the pickup tool can be rotated freely 360° using the control knob at hand. Furthermore, by setting the die puff time, the chips smoothly detach from the pickup collet, improving bonding efficiency.

  • Other painting machines
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12-inch wafer compatible high-speed high-precision twin dispense die bonder

12-inch wafer compatible high-speed high-precision twin dispense die bonder

Ideal for bonding small pin ICs such as QFN.

◆Reduction of TCO through high throughput, small footprint, and shortened changeover time ◆Enhanced operability achieved with easy adjustments and rework functionality ◆Minimization between mount and preform to prevent changes over time and reduce unnecessary movements ◆Equipped with a newly developed twin dispense system to accommodate various pastes ◆Needleless pickup system (optional) enables damage-free pickup

  • Bonding Equipment
  • Die Bonder

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LED package compatible die bonder

LED package compatible die bonder

Ideal for handling all types of LED packages.

◆Minimize the space between the mount and preform, prevent changes over time, and reduce unnecessary movements. ◆Direct transport of substrates, support for workpiece thickness, support for large substrates (optional), and carrier compatibility. ◆Support for larger and modular lighting substrates, offering a variety of bonding patterns and recognition patterns. ◆Facilitate work data input to reduce changeover time. ~Changeover time: 60 minutes (hardware 15 minutes, setup 45 minutes)~

  • Other semiconductor manufacturing equipment
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Daibonda for Tanzaku Frame 'DBD4600S'

Daibonda for Tanzaku Frame 'DBD4600S'

Dai-bonder for tanzaku frames, compatible with both eutectic and epoxy, can also be used for both. Supports small chips (□0.15mm and above) and provides stable operation!

The "DBD4600S" is a die bonder for strip frames, capable of handling small chips starting from 0.15mm, providing stable operation. 【Specifications】 ■ Bonding process: Eutectic (DAF)/Epoxy/Combined machine specifications ■ Chip size: □0.15~1.0mm (Eutectic) ~3.0mm (Epoxy) ■ Bonding accuracy (XY): +/-35μm +/-25μm (when using backside recognition) ■ Bonding accuracy (Θ): +/-3° ■ Bond/Pick load: 30~200gf ■ Compatible work: Lead frames or substrates, carriers ■ Compatible width: Up to 70mm ■ Wafer size: 6 inches or 8 inches Disco ring or expand ring ■ Machine cycle time: 0.3 seconds/chip (Eutectic), varies by conditions ■ Transport method: Pin transport (Eutectic or combined specifications) Gripper transport (Epoxy dedicated machine) ■ External dimensions: 2,200x1,250x1,880mm ■ Weight: 1,200kg ■ Major options: Rotary bond head, backside recognition, collet cleaner, wafer map, strip map, etc. *For more details, please refer to the catalog or feel free to contact us.

  • Soldering Equipment
  • Other semiconductors
  • Die Bonder

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ASMPT manufactured flip chip bonder/die bonder CoS

ASMPT manufactured flip chip bonder/die bonder CoS

CoS (Chip on Submount) is a high-precision die/flip chip bonder.

CoS Alignment Accuracy: ±3µm@3σ Applications: Mainly laser applications The company's products utilize laser heating, allowing for rapid heating implementation compared to pulse heaters. Cycle Time: 5–15 sec/chip Bonding Methods: Eutectic solder, epoxy, UV-curable resin, laser bonding *Ultrasonic bonding is not supported. 〇 Other Die Bonder/Flip Chip Bonder Equipment Alignment Accuracy NANO ±0.3µm @ 3σ AFCplus ±1μm@3σ Nova + ±2.5μm@3σ 〇 Other ASMPT Equipment Available - Multi-laser dicing equipment - Wire bonder equipment - 2D and 3D package appearance inspection equipment - Other die bonder equipment (alignment accuracy 0.2µm–25µm) 〇 ASMPT Equipment Installation Achievements (Total Domestic and International): 2000 units per year for die bonders, 4000 units per year for wire bonders.

  • Bonding Equipment
  • Die Bonder

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ASMPT manufactured AD838L-G2 epoxy die bonder

ASMPT manufactured AD838L-G2 epoxy die bonder

AD838L-G2 is an epoxy die bonder with a strong track record in LED applications.

The AD838L-G2 is a device capable of high-speed bonding of individual chips to a substrate. It also supports multi-die configurations and is equipped with comprehensive inspection features. 【Device Features】 - Alignment accuracy: ±10µm @ 3σ - High-speed bonding possible at approximately 0.25 seconds per chip - Functionality to easily pick up various thin chips - Dual dispense function (supports dots and writing according to various die sizes) - Comprehensive inspection features before and after bonding 【Main Specifications】 - Alignment accuracy: ±10µm @ 3σ - UPH: 14,000 (approximately 0.25 seconds per chip) * Variations may occur depending on bonding materials and die/substrate specifications - Die size compatibility: 0.15 × 0.15 mm – 2.03 × 2.03 mm - Substrate size: Length 60 – 300 mm, Width 60 – 100 mm We will propose the optimal device based on alignment accuracy, cycle time, die size, and other factors. Please feel free to contact us when looking for a die bonder.

  • Other electronic parts
  • Die Bonder

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ASMPT's epoxy die bonder "INFINITE" <New Release>

ASMPT's epoxy die bonder "INFINITE" <New Release>

Bonding chips to substrates or lead frames quickly and accurately.

"INFINITE" is a device that can bond individual chips to substrates and lead frames with ultra-high speed and precision. It is capable of controlling not only the amount and width of epoxy resin dispensed but also the amount of overflow during bonding. It also features inspection functions before and after dispensing and bonding, making it suitable for various applications such as QFN, BGA, MEMS, and SiP. 【Features】 ■ High-speed bonding of thin chips and large dies ■ Compatible with various epoxy materials, including pressureless sintering materials and high-viscosity materials ■ Alignment accuracy of ±20μm @ 3σ ■ Capable of processing at a maximum speed of 0.19 seconds per chip ■ Die size compatibility: 0.2×0.2 to 9×9mm Substrate size compatibility: Length 100 to 300mm, Width 15 to 100mm *You can view the product documentation from the <PDF download>.

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  • Other electronic parts
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ASMPT manufactured eutectic die bonder

ASMPT manufactured eutectic die bonder

High-speed eutectic die bonder

The AD211Plus-II is a device capable of high-speed eutectic bonding of diced chips to substrates or lead frames. It has a strong track record of implementation for LEDs, including automotive lighting and outdoor lighting. Product Features: - Alignment accuracy: 7μm - Cycle time: 540ms - Mirage prevention function during heat-up - Distinctive work holder/heat-up stage - Control function with a void rate of 3% or less - Extensive domestic and international implementation track record - Applications: Automotive, photonics, LEDs, LiDAR

  • LED Module
  • Other optical parts
  • Chip type LED
  • Die Bonder

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Ultra-high precision flip chip die bonder

Ultra-high precision flip chip die bonder

Ultra-high precision alignment within ±1um. Ideal for prototype development.

Prototype/development specialized die flip chip bonder. It combines high-precision die bonding and flip chip bonding functions, allowing for ultra-high precision bonding through manual adjustments on the monitor screen. (For model MOA1250, no-load alignment ±1 micron) High-precision bonding is easily achieved through PC or sequencer control. ● It is compatible with various objects such as silicon wafers, chips, ceramic substrates, and FR4. ● Feedback on the movement amount is provided for each actuator unit, enabling ultra-high precision. (MOA-1250 type) ● Bonding can be performed in low oxygen concentration using an air curtain heat-up stage. ● Various options available, including conical collets, pulse heaters, and scribing functions. ● All equipment is made to order, customizable in layout, budget, and functions.

  • Other semiconductor manufacturing equipment
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Flip chip bonder, high-precision die bonder

Flip chip bonder, high-precision die bonder

Ideal for prototype development of laser diodes and fine chip implementation.

Installation of two cameras, top and bottom. Alignment based on chip alignment marks, bumps, pads, and outlines. High-precision bonding is performed. A general-purpose simple flip chip bonder that is not restricted by device types, materials, or bonding methods.

  • Steel
  • Die Bonder

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Tabletop Semi-Automatic Die Bonder Flip Chip Bonder

Tabletop Semi-Automatic Die Bonder Flip Chip Bonder

Ideal for small-batch, multi-variety production and research and development! With simple operability, it is easy to mount chips and fine components. *Comprehensive catalog available.

Swiss company Dr. Tresky has been developing, manufacturing, and selling various assembly equipment since its establishment in Switzerland in 1980. We offer a lineup ranging from simple fully manual machines with excellent scalability to semi-automatic machines, and we have a wide range of delivery records from low-volume, high-variety production to research and development sites. 【Features of T-5300/T-5300-W】 ■ When mounting chips, regardless of changes in chip thickness, they can always be mounted parallel to the substrate with the set load. ■ Wide work table (250×330mm). ■ With optional combinations, the device configuration can be tailored for specifications such as die bonding and flip chip bonding. ■ Additional options can be retrofitted. ■ When using optional heaters or ultrasonic units, parameters such as heater warm-up timing (simultaneous start with load detection, cooling timing settings), ultrasonic emission timing, Z-axis mounting time, and rise timing can be set arbitrarily. ■ When using the optional beam splitter camera, accuracy of up to ±1μ can be achieved. *For more details, please download the PDF or feel free to contact us.

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Universal Die Bonder "MODEL860Eagle"

Universal Die Bonder "MODEL860Eagle"

Half mirror viewing system! Bonding suitable for the purpose is only the replacement of the head.

The "MODEL860Eagle" is a universal die bonder that allows for bonding suitable for various purposes, including flip chip, eutectic, ultrasonic, thermal compression, and epoxy bonding, all achievable simply by exchanging the head. It features high placement accuracy and excellent operability, made possible by the use of a half-mirror viewing system. 【Product Overview (Excerpt)】 ■ Half-mirror viewing system ■ High-precision servo motor used (Z drive) ■ Automatic temperature control (stage / collet temperature) ■ Bond weight selection (15 g to 700 g or 50 g to 10 kg) ■ Ultra-high precision linear scrub bond head (start position reproducibility within ± 1 micron) *For more details, please refer to the external link or feel free to contact us.

  • Bonding Equipment
  • Die Bonder

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12-inch high-precision die bonder for stacked packages

12-inch high-precision die bonder for stacked packages

Supports high-precision stacked packages such as NAND flash.

The needleless pickup system can pick up ultra-thin chips without damage. World-class bonding precision ~ High precision XY: ±8μm θ: ±0.05 (3σ) ~ Versatile handling ~ Compatible with sizes from 1.0 to 25.0mm and substrate sizes from 100 to 315mm ~

  • Bonding Equipment
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High thermal capacity device compatible soldering die bonder

High thermal capacity device compatible soldering die bonder

It is a high-quality, high thermal capacity device-compatible die bonder for Dpak, To220 to To3p, and IGBT.

◆Bonding accuracy XY: ±40µm, Θ: ±3° 3σ ◆Inspection and detection of solder joint quality using DBI ◆Powerful setup wizard ◆Option to choose heater rail unit or adapter rail replacement

  • Bonding Equipment
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8-inch wafer compatible high-speed high-precision twin dispense die bonder

8-inch wafer compatible high-speed high-precision twin dispense die bonder

Ideal for bonding small pin ICs such as QFN.

◆Best TCO 　~Small footprint, reduced changeover time~ ◆Best Quality 　~Supports fast-drying paste~ ◆Wide lead frame compatibility 　~Lead frame size: W102mm × L300mm~ ◆Equipped with newly developed twin dispense system 　~Compatible with various pastes, stable coating performance~ ◆High precision small chip pickup 　~Supports sizes from 0.15 to 8.0mm~

  • Other semiconductors
  • Bonding Equipment
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High-Precision Die Bonder "AB-1000" <Manufactured by Athlete FA>

High-Precision Die Bonder "AB-1000" <Manufactured by Athlete FA>

High-speed Die Bonder compatible with micro and thin chips!

We would like to introduce the high-precision die bonder "AB-1000" manufactured by Athlete FA, which we handle. It achieves mounting accuracy of XY: ±5[μm], θ: ±1[deg] (±3σ). It is compatible with small and thin chips. It comes with calibration, traceability, and post-mount inspection functions. Please feel free to contact us if you have any requests. 【Features】 ■ Achieves high-precision mounting ■ Compatible with small and thin chips ■ Equipped with calibration function ■ Equipped with traceability function ■ Equipped with post-mount inspection function *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate transport device (loader/unloader)
  • Die Bonder

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Texas Corporation Business Introduction

Texas Corporation Business Introduction

Thoroughly manage the situation and take action based on the guidelines to "raise" it.

Texas Corporation inherits the die bonding technology of Nidec Tosok Corporation and practices the automation of semiconductor manufacturing equipment based on that technology. We implement a safety-first management philosophy, thoroughly manage pre-conditions, and act in accordance with our guiding principles. 【Product Information】 ○DBD4200R / EBD4200R ○DBD4600S / EBD4600 ○DBD3580SW ○EBD4350S For more details, please contact us or download the catalog.

  • Other semiconductor manufacturing equipment
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Die Bonding for Hoop Frame 'DBD4200R'

Die Bonding for Hoop Frame 'DBD4200R'

Die bond for hoop frames, compatible with both eutectic and epoxy (dual-use specification available), supports small chips (from 0.15mm) and provides stable operation!

Die Bonder for Hoop Frame "DBD4200R" Compatible with small chips starting from 0.15mm. 【Specifications】 ■ Joining process: Eutectic/Epoxy/Combined machine specifications ■ Chip size: □0.15~1.0mm (Eutectic) ~3.0mm (Epoxy) ■ Bond accuracy (XY): +/-35μm ■ Bond accuracy (Θ): +/-3° ■ Bond/Pick load: 30~200gf ■ Compatible work: Lead frames or substrates, carriers ■ Maximum width supported: Up to 78mm ■ Wafer size: 6 inches or 8 inches ■ Disco ring or expand ring ■ Machine cycle time: 0.25 seconds/chip (Eutectic), depending on various conditions ■ Transport method: Roller transport ■ External dimensions: 1,740x1,150x1,185mm ■ Weight: 1,000kg ■ Major options: Rotary bond head, uncoiler, cutter, wafer map, post-bond recognition, etc. *For more details, please refer to the catalog or feel free to contact us.

  • Soldering Equipment
  • Other semiconductors
  • Die Bonder

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Daibond for Tanzaku Frame 'EBD4350S'

Daibond for Tanzaku Frame 'EBD4350S'

Tanzaku frame double-sided adhesive, compatible with both epoxy and DAF, suitable for fast-drying paste.

The "EBD4350S" die bonder for short strips is an epoxy die bonder compatible with fast-drying paste. 【Specifications】 ■ Joining process: Epoxy/DAF/dual-use machine specifications ■ Chip size: □0.15~3.0mm ■ Bond accuracy (XY): +/-35μm, +/-25μm (when using backside recognition) ■ Bond accuracy (Θ): +/-3° ■ Bond/pick load: 30~200gf ■ Compatible workpieces: Lead frames or substrates, carriers ■ Compatible width: Up to 70mm ■ Wafer size: 6 inches or 8 inches, disco ring or expand ring ■ Machine cycle time: 0.35 seconds/chip, depending on various conditions ■ Transport method: Gripper transport ■ External dimensions: 1,680x1,135x1,645mm ■ Weight: 1,300kg ■ Major options: Rotary bond head, backside recognition, up-down mechanism, wafer map, strip map, etc. *For more details, please refer to the catalog or feel free to contact us.

  • Soldering Equipment
  • Other semiconductors
  • Die Bonder

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Fasford Technology "SiP Bonder (DB830plus+)"

Fasford Technology "SiP Bonder (DB830plus+)"

Achieving high quality and high productivity! Further evolved high-precision SiP bonders compatible with 300mm wafers.

The FASFOR Technology "SiP Bonder (DB830plus+)" is a high-speed, high-performance die bonder that has further evolved from the DB800, which is specifically designed for SiP assembly and compatible with 300mm wafers. It achieves high quality and high productivity through the use of an intermediate stage and is equipped with a vision system that supports positional correction for multi-layer stacking. With clean technology to reduce particles during stacking, it is the optimal die bonder for thin dies and multi-layer stacking. 【Features】 - High quality and high productivity - Multi-layer stacking support - Thin die bonding technology - Clean technology For more details, please contact us or download the catalog.

  • Bonding Equipment
  • Die Bonder

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ASMPT manufactured flip chip bonder/die bonder AFCPlus

ASMPT manufactured flip chip bonder/die bonder AFCPlus

AFC Plus is a flip chip bonder capable of bonding dies to wafers/substrates/dies with high precision.

"AFC Plus" is a device that enables bonding of high-precision, diced chips to wafers/substrates/dies using the company's patented alignment technology. 【Features】 - Alignment accuracy: ±1µm @ 3s - Alignment technology (patented) - Bonding methods during the joining process - Extensive track record in optical communication and silicon photonics - Rich experience in MEMS sensors, LiDAR, VCSEL, etc. - Extensive experience in R&D and mass production facilities 【Main Specifications】 - Alignment accuracy: ±0.2µ@3σ - Cycle time: 20 to 30 sec (varies by material) - Die size: 0.1mm to 20mm - Substrate size: MAX 300 x 300 mm - Bonding force (load): 10g to 2kg - Joining methods: eutectic solder, epoxy, UV-curable resin, laser bonding *Ultrasonic bonding is not supported.

  • Bonding Equipment
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ASMPT AD830Plus Epoxy Die Bonder

ASMPT AD830Plus Epoxy Die Bonder

The AD830Plus is an ultra-fast epoxy die bonder with a cycle time of 0.16 seconds per chip.

The AD830Plus is a device capable of ultra-fast bonding of diced chips to substrates or lead frames. It has a proven track record in various applications, including LED and sensor-related fields. 【Device Features】 - Alignment accuracy: ±25.4µm - Ultra-fast bonding - Equipped with functionality to easily pick up various thin chips - Capable of handling various materials (such as long substrates and reel supply) - Dual dispense/dual stamping functionality - Comprehensive inspection features (before and after bonding) 【Main Specifications】 - Alignment accuracy: ±25.4µm - UPH: 0.16 seconds (163 milliseconds) - Die size compatibility: 0.15mm × 0.15mm – 5.08mm × 5.08mm - Substrate size compatibility: Length 110mm – 300mm, Width 12mm – 102mm We will propose the optimal device based on alignment accuracy, cycle time, die size, and other factors. Please feel free to contact us when looking for a die bonder.

  • Bonding Equipment
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ASMPT manufactured die bonder Photon Pro

ASMPT manufactured die bonder Photon Pro

Multi-Wafer Handling Die Bonder (Auto)

The company's equipment is a die bonder that achieves high precision and high throughput for mass production.

  • Bonding Equipment
  • Die Bonder

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Notice of Participation in "SEMICON JAPAN 2023"

Notice of Participation in "SEMICON JAPAN 2023"

Various manufacturers' products are scheduled to be exhibited! Such as die bonders and mask aligner devices.

Kanematsu PWS Corporation will be exhibiting at "SEMICON JAPAN 2023" held at Tokyo Big Sight. We plan to showcase various products, including ASMPT's backend equipment (die bonders, wire bonders, etc.), SUSS's mask aligners, coaters/developers, and more. We sincerely look forward to your visit. 【Exhibition Overview】 ■ Date: December 13 (Wed) to December 15 (Fri), 2023, 10:00 AM to 5:00 PM ■ Venue: Tokyo Big Sight (East Exhibition Hall) Hall 1 ■ Booth Location: 1704 ■ Address: 3-11-1 Ariake, Koto-ku, Tokyo 135-0063 *For more details, please refer to the related links or feel free to contact us.

  • Other processing machines
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Dai Bonder "MEGA"

Dai Bonder "MEGA"

Equipped with a comprehensive inspection feature! It is possible to check the quality before and after bonding.

"MEGA" is a device that allows multiple types of chips to be bonded to a single substrate in one pass. By adding options, it is possible to vary the precision within a range of 25μm to 2μm. Additionally, it is equipped with comprehensive inspection functions that allow for quality checks before and after bonding. It can be used for various applications such as small-batch production, mass production, and R&D. 【Overview】 ■ Manufacturer: ASMPT ■ Product Name: Multi-chip compatible die bonder for epoxy bonding, UV bonding *For more details, please refer to the PDF document or feel free to contact us.

  • Bonding Equipment
  • Die Bonder

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Ultra-high precision flip chip bonder/die bonder FDB210P

Ultra-high precision flip chip bonder/die bonder FDB210P

Ultra-high precision bonders that achieve both submicron accuracy and mass production capability.

This machine is a flip chip bonder that is optimal for mass production of optical devices that require both sub-micron level ultra-high precision assembly and high production, as well as devices that require high precision mounting. It also supports face-up mounting as an option.

  • Bonding Equipment
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Dia Attach System

Dia Attach System

Supporting the ever-evolving semiconductor applications!

We handle the die attach systems from Besi. To meet the ever-evolving semiconductor applications, we continue to evolve with advanced technology. Please feel free to contact us if you have any requests. 【Four Categories】 ■ Multi-Module Bonder ■ Epoxy Die Bonder ■ Soft Solder Die Bonder ■ Flip Chip Bonder *For more details, please download the PDF or contact us.

  • Other semiconductor manufacturing equipment
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