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Die Bonder Product List and Ranking from 12 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Die Bonder Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. テクノアルファ Tokyo//Electronic Components and Semiconductors
  2. 兼松ＰＷＳ Kanagawa//Industrial Machinery
  3. キヤノンマシナリー Shiga//Industrial Machinery
  4. 4 テクサス Tokyo//Industrial Machinery
  5. 5 ファスフォードテクノロジ Yamanashi//Industrial Machinery
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Die Bonder Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Tabletop Semi-Automatic Die Bonder Flip Chip Bonder テクノアルファ
  2. ASMPT AD830Plus Epoxy Die Bonder 兼松ＰＷＳ
  3. Texas Corporation Business Introduction テクサス
  4. 4 ASMPT manufactured flip chip bonder/die bonder AFCPlus 兼松ＰＷＳ
  5. 5 ASMPT manufactured AD838L-G2 epoxy die bonder 兼松ＰＷＳ

Die Bonder Product List

1～15 item / All 36 items

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Epoxy die bonder

Epoxy die bonder

Easy epoxy bonding is possible.

A machine that easily performs epoxy and silver paste die bonding. The model 7200CR epoxy die bonder features a dispensing tube for applying epoxy materials (adhesives) and silver paste, along with a pickup tool for attracting chips, all integrated into a single bond head. With the operation of the new X-Y-Z three-axis manipulator (patented), it is possible to switch between dispensing mode and pickup mode, as well as perform die bonding. Additionally, since the bond head is equipped with a motor and timing belt, the chips attracted by the pickup tool can be rotated freely 360° using the control knob at hand. Furthermore, by setting the die puff time, the chips smoothly detach from the pickup collet, improving bonding efficiency.

  • Other painting machines

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12-inch wafer compatible high-speed high-precision twin dispense die bonder

12-inch wafer compatible high-speed high-precision twin dispense die bonder

Ideal for bonding small pin ICs such as QFN.

◆Reduction of TCO through high throughput, small footprint, and shortened changeover time ◆Enhanced operability achieved with easy adjustments and rework functionality ◆Minimization between mount and preform to prevent changes over time and reduce unnecessary movements ◆Equipped with a newly developed twin dispense system to accommodate various pastes ◆Needleless pickup system (optional) enables damage-free pickup

  • Bonding Equipment

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LED package compatible die bonder

LED package compatible die bonder

Ideal for handling all types of LED packages.

◆Minimize the space between the mount and preform, prevent changes over time, and reduce unnecessary movements. ◆Direct transport of substrates, support for workpiece thickness, support for large substrates (optional), and carrier compatibility. ◆Support for larger and modular lighting substrates, offering a variety of bonding patterns and recognition patterns. ◆Facilitate work data input to reduce changeover time. ~Changeover time: 60 minutes (hardware 15 minutes, setup 45 minutes)~

  • Other semiconductor manufacturing equipment

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Daibonda for Tanzaku Frame 'DBD4600S'

Daibonda for Tanzaku Frame 'DBD4600S'

Dai-bonder for tanzaku frames, compatible with both eutectic and epoxy, can also be used for both. Supports small chips (□0.15mm and above) and provides stable operation!

The "DBD4600S" is a die bonder for strip frames, capable of handling small chips starting from 0.15mm, providing stable operation. 【Specifications】 ■ Bonding process: Eutectic (DAF)/Epoxy/Combined machine specifications ■ Chip size: □0.15~1.0mm (Eutectic) ~3.0mm (Epoxy) ■ Bonding accuracy (XY): +/-35μm +/-25μm (when using backside recognition) ■ Bonding accuracy (Θ): +/-3° ■ Bond/Pick load: 30~200gf ■ Compatible work: Lead frames or substrates, carriers ■ Compatible width: Up to 70mm ■ Wafer size: 6 inches or 8 inches Disco ring or expand ring ■ Machine cycle time: 0.3 seconds/chip (Eutectic), varies by conditions ■ Transport method: Pin transport (Eutectic or combined specifications) Gripper transport (Epoxy dedicated machine) ■ External dimensions: 2,200x1,250x1,880mm ■ Weight: 1,200kg ■ Major options: Rotary bond head, backside recognition, collet cleaner, wafer map, strip map, etc. *For more details, please refer to the catalog or feel free to contact us.

  • Soldering Equipment
  • Other semiconductors

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[Use Case] High-Precision Die Bonder for Optical Component Packaging and Module Assembly

[Use Case] High-Precision Die Bonder for Optical Component Packaging and Module Assembly

Multiple processes with a single device! Bonding position accuracy of 0.5µm!

The package of optical components consists of the implementation of optical systems (lenses, prisms, apertures, filters, etc.) and electronic components (LD, PD, amplifiers, controllers, etc.). These are widely used in communication technologies where optical signals are converted to electrical signals, or vice versa. High-precision positioning of the optical systems and electronic components during implementation is essential for the normal operation of the package.

  • Bonding Equipment

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High-precision die bonder femto blu with a mounting accuracy of 2.0μm@3σ.

High-precision die bonder femto blu with a mounting accuracy of 2.0μm@3σ.

This is a high-precision die bonding machine with ultra-low load control, fully automatic operation, and compatibility with fine chips. *Technical materials are also available!

This is a die bonder device that supports various bonding processes for prototype development and high-yield manufacturing, particularly suitable for the assembly of optical components and optoelectronic components. It achieves a stable process manufacturing environment and employs a sealed enclosure that considers the safety of process gas usage and UV irradiation for operating personnel. 【Key Features】 • Mounting accuracy of 2μm@3σ • Multi-chip support • Cost-effective equipment configuration • Compatible with various assembly processes (adhesive, solder, thermal compression, ultrasonic) • Wide range of component supply methods (wafer, waffle pack, Gel-Pak) • Overlay vision alignment system (VAS) with fixed beam splitter • Fully automatic and manual operation *For more details, please download the PDF or contact us.

  • others

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ASMPT manufactured flip chip bonder/die bonder CoS

ASMPT manufactured flip chip bonder/die bonder CoS

CoS (Chip on Submount) is a high-precision die/flip chip bonder.

CoS Alignment Accuracy: ±3µm@3σ Applications: Mainly laser applications The company's products utilize laser heating, allowing for rapid heating implementation compared to pulse heaters. Cycle Time: 5–15 sec/chip Bonding Methods: Eutectic solder, epoxy, UV-curable resin, laser bonding *Ultrasonic bonding is not supported. 〇 Other Die Bonder/Flip Chip Bonder Equipment Alignment Accuracy NANO ±0.3µm @ 3σ AFCplus ±1μm@3σ Nova + ±2.5μm@3σ 〇 Other ASMPT Equipment Available - Multi-laser dicing equipment - Wire bonder equipment - 2D and 3D package appearance inspection equipment - Other die bonder equipment (alignment accuracy 0.2µm–25µm) 〇 ASMPT Equipment Installation Achievements (Total Domestic and International): 2000 units per year for die bonders, 4000 units per year for wire bonders.

  • Bonding Equipment

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ASMPT manufactured AD838L-G2 epoxy die bonder

ASMPT manufactured AD838L-G2 epoxy die bonder

AD838L-G2 is an epoxy die bonder with a strong track record in LED applications.

The AD838L-G2 is a device capable of high-speed bonding of individual chips to a substrate. It also supports multi-die configurations and is equipped with comprehensive inspection features. 【Device Features】 - Alignment accuracy: ±10µm @ 3σ - High-speed bonding possible at approximately 0.25 seconds per chip - Functionality to easily pick up various thin chips - Dual dispense function (supports dots and writing according to various die sizes) - Comprehensive inspection features before and after bonding 【Main Specifications】 - Alignment accuracy: ±10µm @ 3σ - UPH: 14,000 (approximately 0.25 seconds per chip) * Variations may occur depending on bonding materials and die/substrate specifications - Die size compatibility: 0.15 × 0.15 mm – 2.03 × 2.03 mm - Substrate size: Length 60 – 300 mm, Width 60 – 100 mm We will propose the optimal device based on alignment accuracy, cycle time, die size, and other factors. Please feel free to contact us when looking for a die bonder.

  • Other electronic parts

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ASMPT's epoxy die bonder "INFINITE" <New Release>

ASMPT's epoxy die bonder "INFINITE" <New Release>

Bonding chips to substrates or lead frames quickly and accurately.

"INFINITE" is a device that can bond individual chips to substrates and lead frames with ultra-high speed and precision. It is capable of controlling not only the amount and width of epoxy resin dispensed but also the amount of overflow during bonding. It also features inspection functions before and after dispensing and bonding, making it suitable for various applications such as QFN, BGA, MEMS, and SiP. 【Features】 ■ High-speed bonding of thin chips and large dies ■ Compatible with various epoxy materials, including pressureless sintering materials and high-viscosity materials ■ Alignment accuracy of ±20μm @ 3σ ■ Capable of processing at a maximum speed of 0.19 seconds per chip ■ Die size compatibility: 0.2×0.2 to 9×9mm Substrate size compatibility: Length 100 to 300mm, Width 15 to 100mm *You can view the product documentation from the <PDF download>.

  • ASMPT_Logo_Color_RGB_Claim_bottom.jpg
  • Other electronic parts

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ASMPT manufactured eutectic die bonder

ASMPT manufactured eutectic die bonder

High-speed eutectic die bonder

The AD211Plus-II is a device capable of high-speed eutectic bonding of diced chips to substrates or lead frames. It has a strong track record of implementation for LEDs, including automotive lighting and outdoor lighting. Product Features: - Alignment accuracy: 7μm - Cycle time: 540ms - Mirage prevention function during heat-up - Distinctive work holder/heat-up stage - Control function with a void rate of 3% or less - Extensive domestic and international implementation track record - Applications: Automotive, photonics, LEDs, LiDAR

  • LED Module
  • Other optical parts
  • Chip type LED

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Ultra-high precision flip chip die bonder

Ultra-high precision flip chip die bonder

Ultra-high precision alignment within ±1um. Ideal for prototype development.

Prototype/development specialized die flip chip bonder. It combines high-precision die bonding and flip chip bonding functions, allowing for ultra-high precision bonding through manual adjustments on the monitor screen. (For model MOA1250, no-load alignment ±1 micron) High-precision bonding is easily achieved through PC or sequencer control. ● It is compatible with various objects such as silicon wafers, chips, ceramic substrates, and FR4. ● Feedback on the movement amount is provided for each actuator unit, enabling ultra-high precision. (MOA-1250 type) ● Bonding can be performed in low oxygen concentration using an air curtain heat-up stage. ● Various options available, including conical collets, pulse heaters, and scribing functions. ● All equipment is made to order, customizable in layout, budget, and functions.

  • Other semiconductor manufacturing equipment

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Flip chip bonder, high-precision die bonder

Flip chip bonder, high-precision die bonder

Ideal for prototype development of laser diodes and fine chip implementation.

Installation of two cameras, top and bottom. Alignment based on chip alignment marks, bumps, pads, and outlines. High-precision bonding is performed. A general-purpose simple flip chip bonder that is not restricted by device types, materials, or bonding methods.

  • Steel

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Tabletop Semi-Automatic Die Bonder Flip Chip Bonder

Tabletop Semi-Automatic Die Bonder Flip Chip Bonder

Ideal for small-batch, multi-variety production and research and development! With simple operability, it is easy to mount chips and fine components. *Comprehensive catalog available.

Swiss company Dr. Tresky has been developing, manufacturing, and selling various assembly equipment since its establishment in Switzerland in 1980. We offer a lineup ranging from simple fully manual machines with excellent scalability to semi-automatic machines, and we have a wide range of delivery records from low-volume, high-variety production to research and development sites. 【Features of T-5300/T-5300-W】 ■ When mounting chips, regardless of changes in chip thickness, they can always be mounted parallel to the substrate with the set load. ■ Wide work table (250×330mm). ■ With optional combinations, the device configuration can be tailored for specifications such as die bonding and flip chip bonding. ■ Additional options can be retrofitted. ■ When using optional heaters or ultrasonic units, parameters such as heater warm-up timing (simultaneous start with load detection, cooling timing settings), ultrasonic emission timing, Z-axis mounting time, and rise timing can be set arbitrarily. ■ When using the optional beam splitter camera, accuracy of up to ±1μ can be achieved. *For more details, please download the PDF or feel free to contact us.

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  • T-4909-AE?.png
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  • TRESKY広告画像.jpeg
  • Bonding Equipment

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Universal Die Bonder "MODEL860Eagle"

Universal Die Bonder "MODEL860Eagle"

Half mirror viewing system! Bonding suitable for the purpose is only the replacement of the head.

The "MODEL860Eagle" is a universal die bonder that allows for bonding suitable for various purposes, including flip chip, eutectic, ultrasonic, thermal compression, and epoxy bonding, all achievable simply by exchanging the head. It features high placement accuracy and excellent operability, made possible by the use of a half-mirror viewing system. 【Product Overview (Excerpt)】 ■ Half-mirror viewing system ■ High-precision servo motor used (Z drive) ■ Automatic temperature control (stage / collet temperature) ■ Bond weight selection (15 g to 700 g or 50 g to 10 kg) ■ Ultra-high precision linear scrub bond head (start position reproducibility within ± 1 micron) *For more details, please refer to the external link or feel free to contact us.

  • Bonding Equipment

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12-inch high-precision die bonder for stacked packages

12-inch high-precision die bonder for stacked packages

Supports high-precision stacked packages such as NAND flash.

The needleless pickup system can pick up ultra-thin chips without damage. World-class bonding precision ~ High precision XY: ±8μm θ: ±0.05 (3σ) ~ Versatile handling ~ Compatible with sizes from 1.0 to 25.0mm and substrate sizes from 100 to 315mm ~

  • Bonding Equipment

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